(Tokyo) - Namiki Produce sapphire wafer 2, 3 and 4 for blue/white LED and LD. (c-plane & r-plane) We satisfy highly demanding requirements in the compound semiconductor industry for its surface bow, thickness variation, scratch and contamination with our precision processing technologies, featuring the most suitable crystal orientation (c-plane) off-angle for lll-Nitride EPITAXIAL Growth with form of concave surface. Our primarily established factory production lines only for sapphire wafer have ever processing from growing single crystal sapphire to scribing, grinding, high accurate polishing and quality inspection within the production lines that enable to mass-production. Namiki also offers any desired forms, any orientation and its accuracy to meet various needs in the blue/white LED industry. (sapphire, wafer, LED, LD, GaN, substrate, MOCVD, HVPE)
(Tokyo) -(2001) Bumping foundry company. Process is Electorless Plating. Bump material is Nickel and Gold. (UBM, Bump, Electorless Plating, Zincate, Nickel, Gold, Wafer, Bumping)
(Tokyo) -(2000) Semiconductor related resources for the semiconductor industry. Free Listing Available. (semiconductor, vacuum, wafer, silicon, pump, tweezers, wand, semi, semicon, diaphragm)
(Tokyo) -(1998) We are manufacturing wafer handling tools such as vacuum wands, wafer tweezers, wafer aligners and other related products for the silicon wafer process. ESD safe products and wands for 300mm wafers are also available. (semiconductor, wafer, vacuum, tweezers, electronics, etch, 300mm, silicon, fab, substrate)
(Ibaraki) -(1998) Precision polishing and cleaning of electronic materials, semiconductor materials, optical materials and the other single crystals. (NIHON-EXCEED, single-crystal, silicon, compound-semiconductor, oxides, optical-materials, wafers, precision-polishing, lapping)
